Aerogen Systems
New accelerator entry · 2026-08-16 · the record
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We are building the future of chip manufacturing. Chips are more advanced than ever, and the features inside them keep getting smaller.
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New accelerator entry · 2026-08-16 · the record
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We are building the future of chip manufacturing. Chips are more advanced than ever, and the features inside them keep getting smaller. But the cleanroom infrastructure supporting their manufacture has not scaled at the same pace. Intel, TSMC, Samsung, and others spend billions building and operating massive cleanrooms, only to isolate their most advanced wafers from the surrounding facility as much as possible. We think that architecture is backwards. Instead of making the entire building cleaner, why not make the machinery itself as clean as possible? Talos is our proprietary tool-integrated purification system. It sits directly inside semiconductor equipment and continuously destroys airborne molecular contaminants before they reach the wafer. Instead of fighting contamination by constantly flooding tools with ultra-high-purity nitrogen, Talos keeps the environment inside the machine 10–100x cleaner, without the massive purge-gas bill. Talos is powerful on its own, but it is also the foundation for a much bigger vision: the Cleanpipe. The Aerogen Systems Cleanpipe is an ultra-clean interconnect infrastructure that protects wafers as they move from machine to machine across the fab. Rather than relying on a billion-dollar cleanroom to protect every cubic foot of factory space, Cleanpipe creates a controlled environment only where cleanliness actually matters: around the wafer. Talos cleans the tools. Cleanpipe connects them. Eventually, we delete the cleanroom and build more advanced chips, at greater scale, with radically less infrastructure. With cleanpipes connecting tools, chip fabs can exist anywhere.
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Moore's Law runs clean. Aerogen Systems builds point-of-use active filtration that captures and chemically degrades airborne acids and organics in semiconductor manufacturing, protecting wafers between process steps where conventional AMC controls fall short.
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